收藏我们   ENGLISH  
客服QQ
  点击这里给我发消息505255386
微信
  微信公共号
关键词查询
范围:  
提 交
《工程塑料应用》 2020年第10期
DOI:10.3969/j.issn.1001-3539.2020.10.012
基于灰色关联分析法的COC芯片翘曲变形注塑工艺优化
舒海涛1,刘治华1,梁帅2,李洋1,徐刚1,张瑞根1
1.郑州大学机械与动力工程学院,郑州 450001; 2.广东顺德创新设计研究院,广东佛山 528311 
Optimization of Injection Molding Process for Warpage of COC Chip based on Grey Relational Analysis
Shu Haitao1, Liu Zhihua1, Liang Shuai2, Li Yang1, Xu Gang1, Zhang Ruigen1
1. School of Mechanical and Power Engineering, Zhengzhou University, Zhengzhou 450001, China; 2. Guangdong Shunde Innovation Design and Research Institute, Foshan 528311, China 
摘要:针对微流控芯片在注射成型过程中出现的翘曲变形现象,选取环烯烃类共聚物(COC)材料,结合模具温度、熔体温度、保压压力、保压时间、注塑压力5个工艺参数设计正交试验。采用灰色关联分析法对正交试验结果进行了分析,通过Moldflow模拟分析工艺参数对微流控芯片注射成型翘曲变形的影响,运用信噪比对实验结果进行处理,并采用灰色关联度模型分析各工艺参数对芯片翘曲变形的影响程度。将正交试验极差分析结果与灰色关联分析法所得结果进行比较,发现灰色关联分析法所得结果优于极差分析的结果,得出影响COC芯片翘曲变形的顺序从大到小为熔体温度、模具温度、保压压力、保压时间、注塑压力,并得到最优工艺参数为模具温度120℃、熔体温度265℃、保压压力100 MPa、保压时间14 s、注塑压力125 MPa。该方法能有效提高制品质量,经优化后收缩不均翘曲变形量降低了29.76%。 
Abstract:In view of the warpage of microfluidic chips during injection molding, cycloolefin copolymer (COC) material was selected, the orthogonal test was designed based on five technological process parameters, namely mould temperature, melt temperature, holding pressure, holding time and injection pressure. The results of orthogonal test were analyzed by grey relational analysis, Moldflow simulation was used to analyze the influences of the process parameters on warpage deformation of microfluidic chip injection molding, the signal-to-noise ratio was used to process the experimental results, and the gray correlation model was used to analyze the degree of influence of each process parameter on the warpage of the chip. Comparing the range analysis results of the orthogonal test with the results of the gray correlation analysis method, it is found that the results of grey relational analysis are better than those of range analysis, it is concluded that the order of influencing COC chip warpage from large to small is melt temperature, mould temperature, holding pressure, holding time and injection pressure, and the optimal process parameters are mould temperature 120℃, melt temperature 265℃, holding pressure 100 MPa, holding time 14 s and injection pressure 125 MPa. This method can improve product quality effectively, after optimization, the warping deformation due to uneven shrinkage is reduced by 29.76%. 
关键词:微流控芯片;工艺参数优化;翘曲变形;正交试验;灰色关联度分析 
Keywords:microfluidic chip; process parameter optimization; warping deformation; orthogonal test; grey correlation analysis 
基金:河南省重点科技攻关项目(152102210045),河南省高等学校重点科研项目(14A460001) 
本文引用格式:
舒海涛,刘治华,梁帅,等.基于灰色关联分析法的COC芯片翘曲变形注塑工艺优化[J].工程塑料应用,2020,48(10):65-70.
Shu Haitao,Liu Zhihua,Liang Shuai,et al. Optimization of injection molding process for warpage of COC chip based on grey relational analysis[J]. Engineering Plastics Application,2020,48(10):65-70. 

原文:
 
相似文章:
  基于MPI的雾灯盖板高光成型参数优化
2020年第08期
  冷却系统对ABS材质汽车后视镜外壳翘曲变形影响
2020年第07期
  帆船绳钩注塑模具设计与工艺优化
2020年第06期
  选择性激光烧结聚苯乙烯蜡模的尺寸精度
2020年第03期
  注塑机料筒温度调控和计算机仿真研究
2020年第01期
  FDM 3D打印工艺参数对PLA制件力学性能的影响
2020年第01期
  基于预变形的汽车碳罐盖板翘曲变形优化
2019年第10期
  打印参数对FDM成型ABS制品性能的影响
2019年第10期
  基于Moldflow的储物盒注塑成型模拟及试验验证
2019年第08期
  车灯面罩热板焊接退火参数优化
2019年第05期
《工程塑料应用》杂志社 版权所有,未经授权禁止复制或者建立镜像
地址:山东省济南市天桥区田庄东路3号 邮编:250031
电话:0531-85878057 85878223 85878278 传真:0531-85947355
鲁ICP备05018524号-5